Precision Carrier Tape Packaging Solutions from China
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Front view of embossed carrier tape reel loaded with components for automated SMT feeding
Double embossed carrier tape reels showing packaging capacity for SMT production lines
Back side structure of embossed carrier tape reel designed for stable tape and reel packaging
Embossed carrier tape reel showing pocket design for secure electronic component placement
Stacked embossed carrier tape reels used for SMT tape and reel packaging of electronic components
Front view of embossed carrier tape reel loaded with components for automated SMT feeding
Double embossed carrier tape reels showing packaging capacity for SMT production lines
Back side structure of embossed carrier tape reel designed for stable tape and reel packaging
Embossed carrier tape reel showing pocket design for secure electronic component placement
Stacked embossed carrier tape reels used for SMT tape and reel packaging of electronic components

Embossed Carrier Tape for SMT Automated Packaging

Embossed carrier tape is used with cover tape to package electronic components for SMT automated assembly.

Precision-formed pockets maintain component orientation and pitch consistency, supporting stable feeding through standard pick-and-place systems.

Both standard and custom pocket designs are developed based on component geometry and feeding requirements.

  • Designed for SMT automated pick-and-place feeding
  • Compatible with standard and custom pocket designs
  • EIA-481-D compliant dimensional control
  • Engineered for stable feeding with matched cover tape

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Product Overview

  • Embossed carrier tape is used with cover tape for SMT automated assembly, where feeding stability and positional accuracy are critical to continuous production. In this context, carrier tape performance is determined not only by pocket shape, but by consistent forming accuracy, pitch control, and reliable interaction with feeders and cover tape.

    At Jiushuo, embossed carrier tape is engineered from a manufacturing and feeding perspective rather than a fixed catalog format. Pocket geometry, depth, and pitch are developed based on component shape and handling behavior to maintain stable orientation and controlled exposure at the pickup point, supporting both standard and custom components in high-speed SMT operations.

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Materials Options

Material selection for embossed carrier tape is driven by component geometry, handling behavior, and process stability rather than cost alone.

PS, PC, ABS, PET, and APET are commonly used to address these requirements, with final selection based on the component’s physical profile and SMT process conditions.

Specifications & Design Capabilities

Standard Tape Parameters

Item Standard Options
Materials PS, PET, PC, ABS (ESD anti-static available)
Tape Width 8, 12, 16, 24, 32, 44, 56, 72, 88, 104, 120 mm
Thickness 0.25 – 1.0 mm (multiple standard gauges available)
Color Black, white, transparent, blue, green
Reel Length 1–1500 m / reel (custom lengths available)
Carrier Tape Width (mm) 81216243244567288
Cover Tape Width (mm) 5.3 9.3 13.3 21.3 25.5 37.5 49.5 65.5 81.5
Cover Tape Length 200m/R 300m/R 400m/R 480m/R 500m/R Custom Custom Custom Custom

Final tape width and cover tape selection should be confirmed based on pocket design and feeder compatibility.

Pocket Design Capabilities

  • Pocket size & depth control are defined to limit vertical movement and prevent component lift, bounce, or rotation during feeder indexing.
  • Pitch accuracy is engineered to match feeder sprocket advance, ensuring consistent component presentation at the pickup position.
  • Pocket geometry is adapted to support stable orientation, particularly for asymmetrical or non-standard component outlines.
Precise pocket forming and dimensional control are essential to maintaining stable feeding, repeatable pickup, and uninterrupted operation on high-speed SMT pick-and-place systems.

Standards & Compliance

  • EIA-481-D Compliant

    Dimensional control and indexing features are aligned with industry-defined feeder and handling requirements.

  • RoHS Compliant

    All materials meet applicable restrictions on hazardous substances.

  • Custom Designs Supported

    Non-standard pocket designs are engineered to maintain required process compatibility and compliance criteria.

Typical Components & Applications

  1. Top-down view of embossed carrier tape holding dense semiconductor and passive SMD components in uniform pockets

    Semiconductor & Passive Components

    ICs, resistors, inductors, capacitors, diodes, transistors, oscillators

  2. Angled close-up of interconnection and protection components packaged in embossed carrier tape pockets for SMT feeding

    Interconnection & Protection Components

    Connectors, terminals, fuses, relays

  3. Macro close-up of precision stamped metal parts and spring contacts placed in custom embossed carrier tape pockets

    Precision Mechanical & Metal Parts

    Stamped metal parts, precision spring contacts, mechanical components

  4. Functional electronic modules and special SMD parts secured in deep embossed carrier tape pockets for stable SMT feeding

    Functional Modules & Special SMD Parts

    Communication modules, SMD motors

Production & Lead Time

  • Design Drawing

    Design drawings are prepared based on confirmed component data, typically within approximately 2 hours.

  • Sampling

    Samples are produced for pocket fit and feeding verification, usually completed within 1–3 days.

  • Mass Production

    Mass production is scheduled according to approved samples and order volume, with typical lead times of 3–10 days depending on quantity.

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